하드램

Laser Glass Cutting 장비

초단파 레이저인 Pico Second Laser를 이용하여 Glass에 Crack을 전파시켜
커팅하는 최신 레이저 설비 입니다.

Model

HFG400S / HFG400CP / HFG400CF

특징

1. Kerf-less filament separation process
직선 / 곡선 / Angled/Chamfer cut

2. 커팅 후 강도를 보임.

3. 직선 및 곡선 동시 cutting 가능

4. 380mm x 480mm sheet size에 대해 가공

5. Cutting speed : 300mm/sec ~ 2000mm/sec

6. Cutting 후 thermal separation process 적용 가능

사양

항 목		사양
Laser	Oscillator	Infra Red
Laser	Mode of operation	Pulsed Pico second Laser
Optic	Head	HMU
Optic	Vision	CCD Vision System
Main Stage(X-Y)	Stage Type	Cross Type Linear stage
	Motor Type	Linear Servo Motor
	Position Accuracy	±3㎛
	Repeatability	±1㎛
Z-Axis stage	Stage Type	Ball Screw Type
	Motor Type	Step Motor
	Position Accuracy	±4㎛
	Repeatability	±0.5㎛
Control Unit	Motion Controller	Real time Motion controller
Control Unit	Operation	PC & Switch Box
Utility	Electric Power	3 phase 60Hz, AC220V, 0.36KW
Utility	CDA	Ø12, 0.4 ~0.6Mpa, 700NL/Min
외형 치수(mm)		1,600 (L) x 2,000 (W) x 1,600 (H)
Weight(kg)		Approx. : 2500 ( Main system only)
Pass Line		900mm
Loading/Unloading		Manual (Auto loader / Unloader option)

적용분야

Touch panel / LCD / Glass

적합재질
(적용 가능 Material)

0.05mm ~ 12mm 비강화 / 강화 Glass
단판 / 합판 Glass 모두 가능
Sapphire
Crystals
Ceramics

Laser Glass Cutting 장비 샘플사진