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제품소개 WAFER STATION

WAFER STATION

WAFER STATION

Equipment that performs scribing or hole drilling/patterning on wafers of semiconductors or solar cells.

Laser can be selected, so a wide range of processing is possible depending on the purpose of work.

Model

HR-WPH-L

특징

Ultra high accuracy/Various alignment method/Easy editing of scribing/drilling shape

사양

Position accuracy ≤±500nm

In-Position Accuracy ≤±50nm

Stage Moving Speed ≤250mm/s

Working Spec(IR Laser case)

  1. - Scan Speed : 1 ~ 4 m/sec

  2. - Resolution : 0.058urad

  3. - FOV : 160 * 160mm

  4. - Telecentricity : ≤3 deg

  5. - Spot size : 16.2um +/-10% 1/e2

  6. - Working Distance : 500mm

  7. * Specs vary depending on the type of laser

적용분야

Semiconductor Wafer
Solar Cell Wafer

적합재질

Silicone

WAFER STATION 장비 샘플 사진

  • MARKING SAMPLES