Hardram, a company seeking to lead laser applications! COMPANY

About Us Company History

A company
that implements “customer surprise”,
over and above customer satisfaction.

With our technology, innovation, and
genuine efforts, we will surprise you,
the customers.

A company
that grows with its customers.

We will keep the attitude of
sticking together and realizing that
individualdevelopment is none
other than that of the company.

A company
that self-evolves.

In the Company, everyone will strive
to make the Company self-evolve,
by treating it as a living organism.

2020 - 2025

  • 2025

    Developed/delivered “2D/3D inspection system with AI technology for various glasses(Mobile, etc)”

  • 2024

    Developed “TGV system and Glass smaller hole drilling system by laser for mobile/other requirement”

  • 2023

    Developed/delivered “large panel size of Micro LED laser transfer systems(Up to G6)”

  • 2022

    Developed “Battery process turnkey solution”

  • 2021

    Developed “wafer patterning system

  • 2021

    Establishment of Hardram Research Institute

2010 - 2019

  • 2019

    Developed/delivered Micro LED laser Transfer system

  • 2019

    uLED Display Hardram Transcription Success

  • 2018

    Developed Laser UTG(Ultra Thin Glass) cutting system with automatic loading/unloading

  • 2018

    uLED Display Transcription Facility Task Agreement

  • 2018

    Developed "Laser Link cut with Roll-to-Roll (USA project)"

  • 2017

    Developed “Ink Trimming system”

  • 2016

    Developed ITO Patterning by laser trimming

  • 2016

    Delivered R2R Flexible Glass Laser Cutting & Splicing System

  • 2016

    Developed "PAD Laser welding system“ for Mobile (devices)

  • 2014

    Developed “PET Film cutting system HPT series” for Mobile (devices)

  • 2013

    Delivered R2R Polarizer Film cutting system for Japan customers

  • 2013

    Developed R2R Laser flexible-glass cutting/splicing system

  • 2013

    Developed "Femto second Glass cutting & Window cutting system"

  • 2011

    Developed "AMOLED Laser Inducing Thermal Imaging (LITI) system"

2000 – 2009

  • 2009

    Developed "Laser glass scribing/ breaking & Laser R-cutting/Hole drilling system"

  • 2008

    Developed Roll to Roll Laser Slitting system for Polarized film

  • 2007

    Developed Lead Frame R2R Exposing system

  • 2007

    Developed the world’s first “Laser Direct Patterning system” for PDP

  • 2005

    Start R2R & Wet process engineering(Etching/Plating)

  • 2005

    Recipient of Jang Young-sil Award for developing "Laser Tilting system”

  • 2003

    Developed Laser Marking system on LCD/OLED Panel as the first developer in Korea

  • 2003

    Developed the world’s first 6-Gen Laser Titler system for LCD

  • 2000

    Incorporated Hardram Co., Ltd.