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Our Products WAFER STATION

WAFER STATION

WAFER STATION

Equipment that performs scribing or hole drilling/patterning on wafers of semiconductors or solar cells.

Laser can be selected, so a wide range of processing is possible depending on the purpose of work.

Model

HR-WPH-L

Characteristics

Ultra high accuracy/Various alignment method/Easy editing of scribing/drilling shape

Specifications

Position accuracy ≤±500nm

In-Position Accuracy ≤±50nm

Stage Moving Speed ≤250mm/s

Working Spec(IR Laser case)

  1. - Scan Speed : 1 ~ 4 m/sec

  2. - Resolution : 0.058urad

  3. - FOV : 160 * 160mm

  4. - Telecentricity : ≤3 deg

  5. - Spot size : 16.2um +/-10% 1/e2

  6. - Working Distance : 500mm

  7. * Specs vary depending on the type of laser

Application fields

Semiconductor Wafer
Solar Cell Wafer

Suitable materials

Silicone

WAFER STATION Sample photos

  • MARKING SAMPLES