Hardram

Laser Glass Cutting Equipment

It is the latest laser equipment which spreads cracks to,
and thereby cuts, glass by use of Pico Second Laser, a microwave laser.

Model

HFG400S / HFG400CP / HFG400CF

Characteristics

1. Kerf-less filament separation processLinear / Curved / Angled/Chamfer cut

2. Showing strength after cutting.

3. Simultaneous cutting of straight lines and curves (simultaneous straight (linear) and curved cutting) possible

4. Machining for 380mm x 480mm sheet size

5. Cutting speed : 300mm/sec ~ 2000mm/sec

6. Applicable to thermal separation process after cutting

Specifications

Category		Specifications
Laser	Oscillator	Infra Red
Laser	Mode of operation	Pulsed Pico second Laser
Optic	Head	HMU
Optic	Vision	CCD Vision System
Main Stage(X-Y)	Stage Type	Cross Type Linear stage
	Motor Type	Linear Servo Motor
	Position Accuracy	±3㎛
	Repeatability	±1㎛
Z-Axis stage	Stage Type	Ball Screw Type
	Motor Type	Step Motor
	Position Accuracy	±4㎛
	Repeatability	±0.5㎛
Control Unit	Motion Controller	Real time Motion controller
Control Unit	Operation	PC & Switch Box
Utility	Electric Power	3 phase 60Hz, AC220V, 0.36KW
Utility	CDA	Ø12, 0.4 ~0.6Mpa, 700NL/Min
외형 치수(mm)		1,600 (L) x 2,000 (W) x 1,600 (H)
Weight(kg)		Approx. : 2500 ( Main system only)
Pass Line		900mm
Loading/Unloading		Manual (Auto loader / Unloader option)

Application
fields

Touch panel / LCD / Glass

Suitable materials
: (Applicable materials)

0.05mm - 12mm unreinforced / reinforced glass, and veneer / laminated glass: All applicable